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Radiation-Tolerant (RT) ProASIC® 3 FPGAs

High-Reliability, Radiation-Tolerant, Flash-Based FPGAs


RT ProASIC 3 FPGAs offer designers of space flight hardware a radiation-tolerant, reprogrammable, nonvolatile logic integration vehicle. They are well suited for low-power space applications requiring up to 35k Logic Elements (LEs).

SEE Mitigation Strategies

Mitigation of observed Single-Event Effects (SEEs) may be required depending on the flight-critical nature of the application. If required, mitigation can be accomplished by the instantiation of Triple-Module Redundancy (TMR) of the clock network, the I/O banks and the D-type flip-flops. Synthesis tools have the ability to generate triple-module redundant data paths. However, TMR is not the most efficient way of achieving mitigation in the combinatorial logic and the embedded SRAM memory. Alternative strategies exist for nonvolatile FPGAs, such as dual-redundant, combinatorial pathways using guard gates and short delay elements. Such strategies are explained in more detail in the radiation reports. 

Features

  • Highly reliable, nonvolatile reprogrammable Flash technology
  • Up to 620 user I/Os
  • Hermetically sealed packages for space applications (CQFP, CCGA/LGA)

Radiation Tolerance

  • Total dose: 25k
  • SEU less than 1E-10 errors per bit-day (worst-case GEO)
  • SEL immune to LETTH more than 68 MeV-cm2/mg
  • SEU immune to LETTH more than 96 MeV-cm2/mg

Qualification 

  • QML class Q qualification
  • Heritage in many major space programs including ISS, LADEE, Mars InSight, Deimos-2, IRIS, Orbcomm G2, Iridium NEXT and DubaiSat-2

Learn About Our Space FPGA Portfolio


Space Applications

Radiation and Reliability 

Radiation-Tolerant FPGAs

Sub-QML FPGAs

Products 


Device RT3PE600L RT3PE3000L
System Gates 600,000 3,000,000
Logic Tiles 13,824 75,624
Embedded Core RAM Blocks 24 112
Embedded Core RAM Bits 108k 504k
FlashROM Bits 1,000 1,000
Clocks Routed 18 18
PLLs 6 6
I/O Banks 8 8
User I/Os (Maximum) 270 620
I/O Registers 810 1,860
Speed Grades STD, -1 STD, -1
Qualification B, E B, E
CCGA/LGA Package 484 484/896
CQFP Package 256 256

Documentation


Search Documentation
Showing for
Document Category Title Date
User Guide
Radiation-Tolerant ProASIC3 Low Power Spaceflight FPGA Fabric User
15 Jul 2010
User Guide
RadHard/RadTolerant Programming Guide
30 Mar 2003
Supporting Collateral
The Many Flavors of Low-Power, Low-Cost FPGAs White Paper
18 Apr 2008
Supporting Collateral
ProASIC3/E Production FPGAs
19 Jan 2005
Supporting Collateral
Flash FPGAs in the Value-Based Market White Paper
22 Jan 2005
Application Notes
AC374: Simultaneous Read-Write Operations in Dual-Port SRAM for Flash-Based cSoCs and FPGAs App Note
05 Sep 2011
Application Notes
AC382: Zeroization App note
23 Aug 2022
Application Notes
AC311: Physical Interface to QDRII Memories using Actel ProASIC3E FPGAs App Note
06 Jan 2008
Application Notes
AC274: CQFP to FBGA Adapter Sockets App Note
18 Jan 2004
Application Notes
AC341: Microsemi CCGA to CLGA Adapter Socket Application Note
03 Mar 2010
Application Notes
AC342: CQFP to CLGA Adapter Socket Application Note
03 Mar 2010
Application Notes
AN5557: Ceramic Column Grid Array
24 Mar 2025
Application Notes
Moisture Sensitivity Application Note
19 Jan 2026
Application Notes
AC193: Ceramic Chip Carrier Land Grid (CC256) Package Handling App Note
23 Nov 2003
Power Estimator
Power Calculator
06 Feb 2025
Packaging Specifications
CG484 Daisy Chain Package Drawing
27 Oct 2015
User Guide
CG484 Pin Name List
21 Aug 2018
Data Sheets
Radiation-Tolerant ProASIC3 Low-Power Space-Flight FPGAs Datasheet
11 Sep 2008
Packaging Specifications
CG896 Daisy Chain Package Drawing
27 Oct 2015
Data Sheets
CG896 Pin Name List
18 Aug 2022
Data Sheets
CQ256 Pin Name List
18 Aug 2022
Board Design Files
RT3PE3000L-CG896 BSDL
12 May 2010
Board Design Files
RT3PE3000L-CQ256 BSDL
01 Mar 2012
Board Design Files
RT3PE3000L-LG484 BSDL
12 May 2010
Board Design Files
RT3PE600L-CG484 BSDL
18 Apr 2011
Board Design Files
RT3PE3000L-LG896 BSDL
12 May 2010
Board Design Files
RT3PE600L-CQ256 BSDL
01 Mar 2012
Board Design Files
RT3PE600L-LG484 BSDL
18 Apr 2011
Board Design Files
RTProASIC3 IBIS Models
23 May 2016
Application Notes
AC243: Assembly and PCB Layout Guidelines for Chip-Scale Packages
06 May 2013
Application Notes
AC174: Assembly Instructions for CQFP Packages SMT on PCB
06 May 2013
Application Notes
AC220: Package Thermal Characteristics
06 May 2013
Packaging Specifications
Package Thermal Characteristics and Weights
05 Jun 2003
Packaging Specifications
Solder Reflow Profile for Standard and Lead-Free Packages
07 May 2013
Packaging Specifications
Hermetic Package MechanicalConfiguration
15 Jan 2003
Packaging Specifications
Microchip SoC RoHS Certificate of Compliance
07 May 2013
Packaging Specifications
Backward Compatibility of RoHS Compliant components
07 May 2013
User Guide
Prohibitive Substances
07 May 2013
Packaging Specifications
EU RoHS and PFOS, PFOA, and Deca-BDE Compliance Customer Letter
07 May 2013
User Guide
Visual Inspection Criteria for Microchip CQFP Packages
07 May 2013
User Guide
Tray Drawings
04 Jun 2003
User Guide
Leadframe Rework on Microchip CQFP Packages
07 May 2013
User Guide
Package Material Information
19 Jan 2026
Packaging Specifications
Use of Pure Tin Components Intended for Space Application
07 May 2013
Packaging Specifications
CCGA Board Level Testing Report
07 May 2013
User Guide
Prototyping Socket Electrical data list
07 May 2013
Application Notes
AC275: Actel CCGA to FBGA Adapter Socket Instructions
07 Oct 2003
Board Design Files
EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN
07 May 2013
Packaging Specifications
EIA Standard Board Layout of Soldered Pad for QFP Devices and QFP Surface Mount Socket
07 May 2013
Document Category
Title
Date
User Guide
15 Jul 2010
Document Category
Title
Date
User Guide
30 Mar 2003
Document Category
Title
Date
Supporting Collateral
18 Apr 2008
Document Category
Title
Date
Supporting Collateral
19 Jan 2005
Document Category
Title
Date
Supporting Collateral
22 Jan 2005
Document Category
Title
Date
Application Notes
05 Sep 2011
Document Category
Title
Date
Application Notes
23 Aug 2022
Document Category
Title
Date
Application Notes
06 Jan 2008
Document Category
Title
Date
Application Notes
18 Jan 2004
Document Category
Title
Date
Application Notes
03 Mar 2010
Document Category
Title
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Application Notes
03 Mar 2010
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Title
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Application Notes
24 Mar 2025
Document Category
Title
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Application Notes
19 Jan 2026
Document Category
Title
Date
Application Notes
23 Nov 2003
Document Category
Title
Date
Power Estimator
06 Feb 2025
Document Category
Title
Date
Packaging Specifications
27 Oct 2015
Document Category
Title
Date
User Guide
21 Aug 2018
Document Category
Title
Date
Data Sheets
11 Sep 2008
Document Category
Title
Date
Packaging Specifications
27 Oct 2015
Document Category
Title
Date
Data Sheets
18 Aug 2022
Document Category
Title
Date
Data Sheets
18 Aug 2022
Document Category
Title
Date
Board Design Files
12 May 2010
Document Category
Title
Date
Board Design Files
01 Mar 2012
Document Category
Title
Date
Board Design Files
12 May 2010
Document Category
Title
Date
Board Design Files
18 Apr 2011
Document Category
Title
Date
Board Design Files
12 May 2010
Document Category
Title
Date
Board Design Files
01 Mar 2012
Document Category
Title
Date
Board Design Files
18 Apr 2011
Document Category
Title
Date
Board Design Files
23 May 2016
Document Category
Title
Date
Application Notes
06 May 2013
Document Category
Title
Date
Application Notes
06 May 2013
Document Category
Title
Date
Application Notes
06 May 2013
Document Category
Title
Date
Packaging Specifications
05 Jun 2003
Document Category
Title
Date
Packaging Specifications
07 May 2013
Document Category
Title
Date
Packaging Specifications
15 Jan 2003
Document Category
Title
Date
Packaging Specifications
07 May 2013
Document Category
Title
Date
Packaging Specifications
07 May 2013
Document Category
Title
Date
User Guide
07 May 2013
Document Category
Title
Date
Packaging Specifications
07 May 2013
Document Category
Title
Date
User Guide
07 May 2013
Document Category
Title
Date
User Guide
04 Jun 2003
Document Category
Title
Date
User Guide
07 May 2013
Document Category
Title
Date
User Guide
19 Jan 2026
Document Category
Title
Date
Packaging Specifications
07 May 2013
Document Category
Title
Date
Packaging Specifications
07 May 2013
Document Category
Title
Date
User Guide
07 May 2013
Document Category
Title
Date
Application Notes
07 Oct 2003
Document Category
Title
Date
Board Design Files
07 May 2013
Document Category
Title
Date
Packaging Specifications
07 May 2013

IBIS Models


Title
Date
RTProASIC3 IBIS Models 23 May 2016

Note: 

BSDL Models


Title
Date
RT3PE3000L-CG896 BSDL 12 May 2010
RT3PE3000L-CQ256 BSDL 01 Mar 2012
RT3PE3000L-LG484 BSDL 12 May 2010
RT3PE600L-CG484 BSDL 18 Apr 2011
RT3PE3000L-LG896 BSDL 12 May 2010
RT3PE600L-CQ256 BSDL 01 Mar 2012
RT3PE600L-LG484 BSDL 18 Apr 2011

Packaging/PPATs


Title
Date
AC243: Assembly and PCB Layout Guidelines for Chip-Scale Packages 06 May 2013
AC174: Assembly Instructions for CQFP Packages SMT on PCB 06 May 2013
AC220: Package Thermal Characteristics 06 May 2013
Package Thermal Characteristics and Weights 05 Jun 2003
AC274: CQFP to FBGA Adapter Sockets App Note 18 Jan 2004
AC341: Microsemi CCGA to CLGA Adapter Socket Application Note 03 Mar 2010
AC342: CQFP to CLGA Adapter Socket Application Note 03 Mar 2010
AN5557: Ceramic Column Grid Array 24 Mar 2025
Moisture Sensitivity Application Note 19 Jan 2026
Solder Reflow Profile for Standard and Lead-Free Packages 07 May 2013
AC193: Ceramic Chip Carrier Land Grid (CC256) Package Handling App Note 23 Nov 2003
Hermetic Package MechanicalConfiguration 15 Jan 2003
Microchip SoC RoHS Certificate of Compliance 07 May 2013
Backward Compatibility of RoHS Compliant components 07 May 2013
Prohibitive Substances 07 May 2013
EU RoHS and PFOS, PFOA, and Deca-BDE Compliance Customer Letter 07 May 2013
Visual Inspection Criteria for Microchip CQFP Packages 07 May 2013
Tray Drawings 04 Jun 2003
Leadframe Rework on Microchip CQFP Packages 07 May 2013
Package Material Information 19 Jan 2026
Use of Pure Tin Components Intended for Space Application 07 May 2013
CCGA Board Level Testing Report 07 May 2013
Prototyping Socket Electrical data list 07 May 2013
AC275: Actel CCGA to FBGA Adapter Socket Instructions 07 Oct 2003
EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN 07 May 2013
EIA Standard Board Layout of Soldered Pad for QFP Devices and QFP Surface Mount Socket 07 May 2013
Title
Date
Power Calculator 06 Feb 2025

Radiation-tolerant (RT) ProASIC3 FPGAs are the first to offer designers of spaceflight hardware a radiation-tolerant, reprogrammable, nonvolatile logic integration vehicle. They are intended for low-power space applications requiring up to 3,000,000 system gates.

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